Tergeo and Tergeo-plus tabletop plasma cleaner
Oxygen plasma has wide applications in photoresist stripping, descum, organic contamination removal, generating surface functional groups (hydroxyl and carboxyl moieties) to improve adhesive bonding and coating strength. It can turns hydrophobic surface of the silicon wafer, PDMS, metal, plastic, polymer and composite materials into hydrophilic. Oxygen plasma etching can also increase surface roughness of polymer, thus improve bonding strength. Oxygen plasma treatment also has wide application in device packaging, such as wire bonding, die attach, flip-chip underfill and device encapsulation. Oxygen plasma treatment is an important step for microfluidics device fabrication by increasing surface wettability and bonding strength of silicon, glass and PDMS.