Generate oxygen, argon, nitrogen, hydrogen, CF4, SF6, and ambient air plasma to ash photoresist, descum after patterning, TEM/SEM sample and grid cleaning, etch silicon dioxide and nitride, remove hydrocarbon and other surface contamination, change surface energy and improve the bonding strength.
Tergeo series plasma systems are tabletop plasma systems that operate under vacuum conditions. The chamber diameter varies from 4.3 inches (110mm) to 9 inches (230mm).
Here are some typical applications:
Integrated circuit chip cleaning before wire bonding and packaging.
TEM and SEM sample cleaning for hydrocarbon contamination removal.
Plasma treatment for hydrophilic or hydrophobic surface wettability.
Surface preparation to improve epoxy/glue bonding strength.
Glass and optical fiber heads cleaning for optics, laser and communication.
Improve wettability for MEMS microfluidics devices.
Photoresist ashing and descum after patterning.
Device decapsulation for failure analysis.
Contact lens, medical implant and other type medical device surface treatment and activation
Downstream plasma source can be used to generate ambient air (N2+O2), oxygen, argon+oxygen, argon+hydrogen, CF4, NF3 type plasma. The radical generated in the remote plasma source can be used to remove hydrocarbon and fluorocarbon contaminations inside the downstream vacuum chambers and the samples placed inside the chamber.
In-situ sample cleaning for FE-SEM, FIB and TEM
Contamination removal for semiconductor equipment, such as CD-SEM, EBR, EBI, EUVL.
High vacuum chamber cleaning to remove hydrocarbon and fluorocarbon contamination.
Reduce pumping downtime for extreme-high vacuum (EHV) and ultra-high vacuum (UHV) chamber.
Chamber and sample cleaning for XPS, SIMS, AES and atom probe.
Chamber and sample cleaning for ALD, and other film deposition and coating equipment.
The TEM cube chamber can be used to store up to eight TEM specimen holders under a high vacuum (ultimate vacuum in the mid-10-7Torr range). The vacuum level is high enough for leaking check of the in-situ TEM chips. It can also be fitted with a remote EM-KLEEN plasma source to perform plasma cleaning in the chamber. The size of the chamber is 9 inches cube. It can fit fairly large TEM and SEM samples and components. The chamber has a glass front door for observation.
TEM specimen holder vacuum pumping station can store up to six specimen holders under the vacuum condition to help the sample and holder outgas, remove water condensation, and keep the specimen and the holder clean and dry. It can also be used for leak check on the specimen holders.
In collaboration with the ion beam technology group in the Lawrence Berkeley National Laboratory, we develop many high brightness ion sources based on ICP plasma source technologies. Our technical staff can provide customized design specifically optimized for your applications. Our technologies includes: low pressure ion source for sealed tube application; low energy spread (<2eV) muticusp ion source; miniaturized ion source etc.
Our technical staff have decades of experience in designing electron and ion columns capable of sub-nm resolution. We are experienced in designing charged particle optics with MEBS, EGUN, IGUN and Opera simulation software. We can simulation electrostatic and magnetic lenses and deflectors and other customized 3D structures with space charge effect and stochastic charge interaction effect included. Please contact us to discuss your requirement and our capability.