Plasma cleaning, etching, ashing equipment, and SEM/TEM sample cleaning and storage solutions

Tergeo Series Plasma Etcher and Cleaners

Laboratory tabletop plasma etcher, also called plasma cleaners and plasma asher, can be used to generate oxygen, argon, nitrogen, hydrogen, CF4, SF6, ambient air and water vapor plasma. Tergeo series plasma systems are a vacuum plasma equipment that can handle samples with a diameter range from less than 4” to more than 8”. Recipe based fully automatic operation guarantees repeatable results. Models include:

  • Basic Tergeo plasma cleaner with chamber diameter of 4.3” and depth of 11”. High frequency 1.356MHz rf power (0-75W or 0-150W).  Ideal choice university professor’s lab.
  • Tergeo-Plus plasma asher with chamber diameter of 6.3 and depth of 11”. Three rf power options: 0-150Watt, 0-300Watt, 0-500Watt at 13.56MHz.
  • Tergeo-Pro plasma asher increases chamber diameter to 9” and depth to 13.4”. Three rf power options: 0-150Watt, 0-300Watt, 0-500Watt at 13.56MHz. Ideal choice for industrial customers and shared facilities in universities.
  • Tergeo-EM plasma etcher is a specialized plasma cleaning system for SEM and TEM sample cleaning applications. It has been well-received by the TEM laboratories around the world.

Here are some typical applications:

Tabletop plasma cleaner machine for oxygen, argon, SF6, CF4 plasma
Tergeo-Pro Plasma etcher ( plasma asher and plasma cleaner) for oxygen, nitrogen, argon, SF6 type plasma

Integrated circuit chip cleaning before wire bonding and packaging.

TEM and SEM sample cleaning for hydrocarbon contamination removal.

Plasma treatment for hydrophilic or hydrophobic surface wettability.

Surface preparation to improve epoxy/glue bonding strength.

Glass and optical fiber heads cleaning for optics, laser, and communication.

Improve wettability for MEMS microfluidics devices.

Photoresist ashing and descum after patterning.

Device decapsulation for failure analysis.

Contact lens, medical implant and other type medical device surface treatment and activation

Remote Plasma Cleaner for SEM, FIB, TEM, XPS, and Deposition Systems

Downstream plasma source can be used to generate ambient air (N2+O2), oxygen, argon+oxygen, argon+hydrogen, CF4, NF3 type plasma. The radical generated in the remote plasma source can be used to remove hydrocarbon and fluorocarbon contaminations inside the downstream vacuum chambers and the samples placed inside the chamber.

In-situ sample cleaning for FE-SEM, FIB and TEM

Contamination removal for semiconductor equipment, such as CD-SEM, EBR, EBI, EUVL.

High vacuum chamber cleaning to remove hydrocarbon and fluorocarbon contamination.

Reduce pumping downtime for extreme-high vacuum (EHV) and ultra-high vacuum (UHV) chamber.

Chamber and sample cleaning for XPS, SIMS, AES and atom probe.

Chamber and sample cleaning for ALD, and other film deposition and coating equipment.

EM-KLEEN SEM Plasma Cleaner
SEMI-KLEEN plasma cleaner for EBI, EBR and CD-SEM
SEMI-KLEEN Sapphire plasma cleaner
75W portable controller for EM-KLEEN and SEMI-KLEEN plasma cleaner
150Watt controller for SEMI-KLEEN plasma cleaner


The TEM cube chamber can be used to store up to eight TEM specimen holders under a high vacuum (ultimate vacuum in the mid-10-7Torr range). The vacuum level is high enough for leaking check of the in-situ TEM chips. It can also be fitted with a remote EM-KLEEN plasma source to perform plasma cleaning in the chamber. The size of the chamber is 9 inches cube. It can fit fairly large TEM and SEM samples and components. The chamber has a glass front door for observation.

TEM Cube

TEM Specimen Holder Vacuum Storage Station

TEM specimen holder vacuum pumping station can store up to six specimen holders under the vacuum condition to help the sample and holder outgas, remove water condensation, and keep the specimen and the holder clean and dry. It can also be used for leak check on the specimen holders.

TEM holder vacuum storage station

High Brightness Ion Sources

In collaboration with the ion beam technology group in the Lawrence Berkeley National Laboratory, we develop many high brightness ion sources based on ICP plasma source technologies. Our technical staff can provide customized design specifically optimized for your applications. Our technologies includes: low pressure ion source for sealed tube application; low energy spread (<2eV) muticusp ion source; miniaturized ion source etc.

High Resolution Electron and Ion Optics Design Service

Our technical staff have decades of experience in designing electron and ion columns capable of sub-nm resolution. We are experienced in designing charged particle optics with MEBS, EGUN, IGUN and Opera simulation software. We can simulation electrostatic and magnetic lenses and deflectors and other customized 3D structures with space charge effect and stochastic charge interaction effect included. Please contact us to discuss your requirement and our capability.