Tergeo-Plus Plasma Cleaner

Large chamber tabletop plasma cleaner for R&D, low to mid volume production.

The only difference between Tergeo-plus and Tergeo plasma cleaner is the size of the sample chamber. The inner diameter of the sample chamber has been increased from 110mm in Tergeo to 160mm in Tergeo-plus. The depth of the sample chamber is the same, e.g. 280mm.

Tergeo Plus Plasma Cleaner

Click here to learn more about the advantages of Tergeo plasma cleaner over competitors

Application of Tergeo-plus plasma cleaner is similar as the standard Tergeo plasma cleaner, except that it can accommodate larger samples. Here are list of typical applications:


  • Large sample chamber (ID:160mm, L280mm). Enough to accommodate a 4-inch wafer boat and one 6-inch wafer.
  • Cleaning modes: Immersion plasma cleaning for high speed etching and surface modification; remote plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning; pulsed operation to generate plasma with average rf power less than 0.5watt for extremely delicate samples.
  • Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.
  • Plasma sensor: dual plasma strength sensor (patent pending) monitors in-situ plasma source and remote plasma source. Plasma strengths are displayed on the LCD touchscreen display in real-time.
  • Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in MFC, dual plasma strength sensors, automatic impedance matching.
  • Chamber materials: Aluminum flange and thick-wall high purity quartz tube offer enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in pyrex glass.
  • Sample holder: 2mm thick high purity quartz plate
  • Chamber size: inner diameter:160mm; outer diameter: 170mm; depth 280mm
  • RF electrodes: External rf electrodes and antenna design reduces metal sputtering compared with internal metal electrodes in other plasma cleaners.
  • RF power: 13.56MHz high frequency rf power supply with automatic impedance matching for in-situ plasma source. RF power has two options: 0-75watt and 0-150watt. 13.56MHz rf power generates plasma with much higher density than KHz power supply.
  • Gas input: Up to three MFC controlled gas input (0~100sccm). One additional port for venting and purging. ¼ inch Swagelok compression fitting connectors.
  • User interface: 7-inch resistive touchscreen, touch with fingers, no stylus required.
  • Recipe and job support: Total 20 customizable recipes. Up to three cleaning steps in job sequence.


  • AC input: 110V~230V universal AC power support
  • Pumping port: NW/KF25
  • Minimum pumping speed: 1 cfm
  • Ultimate pump pressure: 200mTorr or less