Tergeo Plasma Cleaner

Automatic tabletop plasma cleaner for research laboratories and low volume production

Typical applications:

• Wire bonding, flip-chip underfill, device encapsulation, and decapsulation
• SEM/TEM sample cleaning for carbonaceous contamination removal and oxide reduction
• Surface treat before biomedical coating and improve the hydrophilicity of medical implants
• Optics, glass, and substrate cleaning before epoxy bonding
• Photoresist ashing, descum, and silicon wafer cleaning
• PDMS, microfluidics, glass slides, and lab-on-a-chip
• Improve bonding for metal to metal or composite
• Improve bonding for plastic, polymer, and composite materials

Click here to learn more about the advantages of Tergeo plasma cleaner over competitors

Features:

• TÜV Rheinland certified and confirm to UL, IEC and CSA 61010-1 safety standards. NRTL compliant!
• Cleaning modes: Direct mode and downstream mode. Dual plasma sources for the two plasma cleaning modes. Direct mode plasma cleaning for high-speed etching and surface modification; remote/downstream mode plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning.
• Continuous and pulsed plasma. The pulse ratio can be changed from 100% (continuous) to less than 1%. Tergeo plasma system not only adjusts rf power wattage by 1-watt interval, but also creates continuous and pulsed plasma. Change the plasma intensity by more than several orders of magnitude.
• Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.
• Plasma sensor: dual plasma strength sensor (patent pending) monitors in-situ plasma source and remote plasma source. Plasma strengths are displayed on the LCD touchscreen in real-time.
• Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in MFC, dual plasma strength sensors, automatic impedance matching.
• Chamber materials: Aluminum flange and thick-wall high purity quartz tube offer enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in pyrex glass.
• Quartz chamber size: inner diameter:110mm; outer diameter: 120mm; depth 280mm
• Sample shelf: 2mm thick high purity quartz plate
• RF Antenna: External rf electrodes and antenna design reduce metal sputtering issue found in plasma cleaners with internal metal electrodes.
• RF power: 13.56MHz high-frequency rf power supply with automatic impedance matching for in-situ plasma source. RF power has two options: 0-75watt and 0-150watt, with 1-watt interval. 13.56MHz rf power generates plasma with a much higher density than the KHz power supply.
• Gas input: Up to three mass flow controlled gas inputs (0~100sccm). One additional port for venting and purging. ¼ inch Swagelok compression fitting connectors.
• User interface: 7-inch resistive touchscreen, touch with fingers, no stylus required.
• Recipe and job support: Total of 20 customizable recipes. Up to three cleaning steps in the job sequence.

Requirements:

• AC input: 110V~230V universal AC power support
• Pumping port: NW/KF25
• Vacuum pumping speed: 2.0 cfm or higher.
• The ultimate pressure of the vacuum pump: 50mTorr or less