Cleaning modes: Immersion plasma cleaning for high speed etching and surface modification; remote plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning; pulsed operation to generate plasma with average rf power less than 0.5watt for extremely delicate samples.
RF antenna: External rf electrodes and antenna design reduces metal sputtering issue found in plasma cleaners with internal metal electrodes.
RF power: 13.56MHz high frequency rf power supply with automatic impedance matching for in-situ plasma source. RF power has two options: 0-75watt and 0-150watt. 13.56MHz rf power generates plasma with much higher density than KHz power supply.
Gas input: Up to three mass flow controlled gas input (0~100sccm). One additional port for venting and purging. ¼ inch Swagelok compression fitting connectors.
User interface: 7-inch resistive touchscreen, touch with fingers, no stylus required.
Recipe and job support: Total 20 customizable recipes. Up to three cleaning steps in job sequence.
AC input: 110V~230V universal AC power input support
Pumping port: NW/KF25
Minimum pumping speed: 1 cfm
Ultimate pump pressure: 200mTorr or less
Plasma, Ion and Electron Technology company
We offer tabletop plasma cleaner, plasma etcher, remote plasma sources, and SEM/TEM sample and holder cleaning and storage solutions