TÜV Rheinland certified and confirm to UL, IEC and CSA 61010-1 safety standards. NRTL compliant!
Cleaning modes: Direct mode and downstream mode. Dual plasma sources for the two plasma cleaning modes. Direct mode plasma cleaning for high-speed etching and surface modification; remote/downstream mode plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning.
Continuous and pulsed plasma. The pulse ratio can be changed from 100% (continuous) to less than 1%. Tergeo plasma system not only adjusts rf power wattage by 1-watt interval, but also creates continuous and pulsed plasma. Change the plasma intensity by more than several orders of magnitude.
RF Antenna: External rf electrodes and antenna design reduce metal sputtering issue found in plasma cleaners with internal metal electrodes.
RF power: 13.56MHz high-frequency rf power supply with automatic impedance matching for in-situ plasma source. RF power has two options: 0-75watt and 0-150watt, with 1-watt interval. 13.56MHz rf power generates plasma with a much higher density than the KHz power supply.
Gas input: Up to three mass flow controlled gas inputs (0~100sccm). One additional port for venting and purging. ¼ inch Swagelok compression fitting connectors.
User interface: 7-inch resistive touchscreen, touch with fingers, no stylus required.
Recipe and job support: Total of 20 customizable recipes. Up to three cleaning steps in the job sequence.
AC input: 110V~230V universal AC power support
Pumping port: NW/KF25
Vacuum pumping speed: 2.0 cfm or higher.
The ultimate pressure of the vacuum pump: 50mTorr or less
Plasma, Ion and Electron Technology company
We offer tabletop plasma cleaner, plasma etcher, remote plasma sources, and SEM/TEM sample and holder cleaning and storage solutions