Tergeo Plasma Cleaner

Automatic tabletop plasma cleaner/etcher for research laboratories and low volume production

Plasma Cleaner and plasma asher for PDMS bonding, photoresist descum, sample surface cleaning, 2D materials research

Typical applications:

Click here to learn more about the advantages of Tergeo plasma cleaner over competitors


  • TÜV Rheinland certified and confirm to UL, IEC and CSA 61010-1 safety standards. NRTL compliant!
  • Cleaning modes: Direct mode and downstream mode. Dual plasma sources for the two plasma cleaning modes. Direct mode plasma cleaning for high-speed etching and surface modification; remote/downstream mode plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning.
  • Continuous and pulsed plasma. The pulse ratio can be changed from 100% (continuous) to less than 1%. Tergeo plasma system not only adjusts rf power wattage by 1-watt interval, but also creates continuous and pulsed plasma. Change the plasma intensity by more than several orders of magnitude.
  • Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.
  • Plasma sensor: dual plasma strength sensor (patent pending) monitors in-situ plasma source and remote plasma source. Plasma strengths are displayed on the LCD touchscreen in real-time.
  • Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in MFC, dual plasma strength sensors, automatic impedance matching.
  • Chamber materials: Aluminum flange and thick-wall high purity quartz tube offer enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in pyrex glass.
  • Quartz chamber size: inner diameter:110mm; outer diameter: 120mm; depth 280mm
  • Sample shelf: 2mm thick high purity quartz plate
  • RF Antenna: External rf electrodes and antenna design reduce metal sputtering issue found in plasma cleaners with internal metal electrodes.
  • RF power: 13.56MHz high-frequency rf power supply with automatic impedance matching for in-situ plasma source. RF power has two options: 0-75watt and 0-150watt, with 1-watt interval. 13.56MHz rf power generates plasma with a much higher density than the KHz power supply.
  • Gas input: Up to three mass flow controlled gas inputs (0~100sccm). One additional port for venting and purging. ¼ inch Swagelok compression fitting connectors.
  • User interface: 7-inch resistive touchscreen, touch with fingers, no stylus required.
  • Recipe and job support: Total of 20 customizable recipes. Up to three cleaning steps in the job sequence.


  • AC input: 110V~230V universal AC power support
  • Pumping port: NW/KF25
  • Vacuum pumping speed: 2.0 cfm or higher.
  • The ultimate pressure of the vacuum pump: 50mTorr or less