Tergeo plasma cleaner
Tergeo Plasma System – a cost-effective, versatile solution for plasma etching and cleaning in research and development. With fully automatic system control ensuring consistent, repeatable results, the Tergeo system can generate a wide range of plasma—including oxygen, argon, ambient air, nitrogen, hydrogen, SF6, water vapor, and more—to remove both hydrocarbon and inorganic surface contaminants efficiently. Its advanced capabilities not only clean and activate surfaces but also enhance bonding strength, boost surface energy, and render samples hydrophilic, making it an ideal choice for precise surface preparation and modification
Specifications and Features:
1. RF Power System
- Frequency: 13.56 MHz – over 10× more efficient than low-cost kHz plasma systems at equivalent power.
- Power Output: Options available for 0–75 W or 0–150 W, adjustable in 1-watt increments via recipe settings.
- Impedance Matching: Fully automatic to optimize power transfer.
2. Plasma Operation Modes
- Modes:
- Continuous Mode: Traditional steady-state plasma operation.
- Pulsed Mode: Unique capability with adjustable pulse duty cycles from 100% (continuous) to less than 1%, increasing the plasma intensity dynamic range by 100×.
- Cleaning Techniques:
- High-Speed Direct Mode: Capacitively coupled discharge for aggressive cleaning.
- Gentle Downstream Mode: Inductively coupled discharge for more delicate cleaning applications.
3. Process Monitoring & Control
- Plasma Intensity Monitoring: Real-time quantitative measurement during etching, ashing, and cleaning to ensure process stability and repeatability.
- Control System:
- Fully automated operation based on pre-set recipes (customizable).
- Manual operation available when required.
4. Gas Delivery & Chamber Design
- Process Gases: Compatible with oxygen, argon, hydrogen, nitrogen, CF₄, SF₆, water vapor, and more.
- Gas Delivery:
- Up to three channels with mass flow controller (MFC) regulated gas input.
- Additional venting port for atmospheric pressure venting.
- Chamber:
- Constructed from quartz.
- Inner Diameter: 4.3 inches (110 mm). Depth: 11 inches (280 mm).
5. Vacuum System
- Pressure Sensor: Corrosion-resistant platinum filament Pirani gauge.
- Vacuum Pump Options:
- Premium dry scroll pump rated for oxygen service.
- Oil pump filled with inert PFPE pump oil, oxygen compatible.
6. User Interface & Remote Support
- Interface Options:
- Embedded 7-inch LCD industrial touchscreen.
- Windows PC-based interface.
- Features:
- Fully automatic operation with integrated recipe control.
- Run log storage for process monitoring.
- Remote Support:
- Self-diagnostic capability and log file storage for troubleshooting.
- Remote control access available from the U.S. headquarters if necessary.
7. Physical & Electrical Specifications
- Dimensions: 450 mm (W) × 250 mm (H) × 430 mm (D).
- Weight: Approximately 45 lbs (20 kg).
- Electrical Input: 90–230 V AC, single phase, 10 A.
8. Certifications
- UL 61010-1:2012 R4.16
- CAN/CSA-C22.2 61010-1-12+GI1+GI2 (R2017)
- IEC 61010-1:2010
- CE and TÜV Rheinland marked
- NRTL compliant
Typical applications:
- Wire bonding, flip-chip underfill, device encapsulation, and decapsulation
- SEM/TEM sample cleaning for carbonaceous contamination removal and oxide reduction
- Surface treatment before biomedical coating and improve the hydrophilicity of medical implants
- Optics, glass, and substrate cleaning before epoxy bonding
- Photoresist ashing, descum, and silicon wafer cleaning
- PDMS, microfluidics, glass slides, and lab-on-a-chip
- Improve bonding for metal-to-metal or composite
- Improve bonding for plastic, polymer, and composite materials