Which Tergeo fits your lab?Plasma etching and ashing for failure analysis
Failure analysis is about removing exactly the layer in the way — and nothing else. Tabletop Tergeo plasma systems strip organic coatings and dielectric capping layers dry, evenly and with a readable end point, so the metal, silicon or defect underneath is ready for inspection and probing.
Which plasma removes which layer
| Layer to remove | Typical plasma | Stops on | Data |
|---|---|---|---|
| Parylene conformal coating | O₂ | Metal, glass, silicon, ceramics | ≈230 nm/min, end point, 0.3 Ω contact |
| Polyimide / PBO passivation & stress buffer | Ar + O₂, O₂ + CF₄ | Metal, nitride, oxide | 25 µm film in ≈3 h |
| Photoresist, epoxy residue, organic contamination | O₂, Ar + O₂ | Inorganic layers | Plasma ashing |
| Silicon nitride capping / passivation | CF₄ + O₂, SF₆ | Aluminum, copper (selectivity depends on recipe) | Typically less than 4–10 min |
| Silicon oxide capping / ILD | CF₄, CF₄ + O₂ | Metal lines | Typically less than 4–10 min |
Tergeo systems etch isotropically (they are not RIE tools). That suits blanket layer removal and decapping; use a hard mask where only a local window should open.
Advantages over wet deprocessing
No acids or solvents
No fuming nitric acid, hydrazine-type strippers or hot solvents near your sample — and no residue to rinse out.
Built-in end point
The plasma emission sensor shows when etch by-products disappear — the layer has cleared.
Control from gentle to fast
Pulsed, downstream and direct modes, 1 W power steps and up to 500 W on Tergeo-Plus and Tergeo-Pro.
O₂, CF₄, SF₆, Ar, H₂
Up to three MFC gas lines with mixing, for organics and silicon-based dielectrics in one tool.
Even removal
Low-pressure plasma reaches the whole surface, including the sides and back of packaged parts.
Wafers, die and boards
From single die to 8″ wafers and populated boards, depending on the chamber.
Not sure which plasma cleaner fits your process?
Tell us your samples, size and process gas. Our engineers reply within one to two business days with a recommendation and a quote.